Yield strength in nanocrystalline Cu during high strain rate deformation

Nhon Q. Vo, Robert S. Averback, Pascal Bellon, Alfredo Caro

Research output: Contribution to journalArticle

Abstract

Molecular dynamics simulations are used to study the yield strength of thermally annealed nanocrystalline Cu samples. For strain rates of 1 × 1010 and 1 × 109 s-1, the observed yield strength scales with the fractional number of grain boundary (GB) atoms. This observation suggests a new scaling behavior for the onset of plasticity in nanocrystalline materials, controlled not by the grain size alone, but by a combination of both grain size and degree of GB relaxation, as measured by the GB volume.

Original languageEnglish (US)
Pages (from-to)76-79
Number of pages4
JournalScripta Materialia
Volume61
Issue number1
DOIs
StatePublished - Jul 1 2009

Keywords

  • Hall-Petch
  • Molecular dynamics
  • Nanocrystalline
  • Yield strength

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

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