TY - GEN
T1 - Xplace
T2 - 59th ACM/IEEE Design Automation Conference, DAC 2022
AU - Liu, Lixin
AU - Fu, Bangqi
AU - Wong, Martin D.F.
AU - Young, Evangeline F.Y.
N1 - This research was partially supported by ACCESS - AI Chip Center for Emerging Smart Systems, Hong Kong SAR.
PY - 2022/7/10
Y1 - 2022/7/10
N2 - Placement serves as a fundamental step in VLSI physical design. Recently, GPU-based global placer DREAMPlace[1] demonstrated its superiority over CPU-based global placers. In this work, we develop an extremely fast GPU accelerated global placer Xplace which achieves around 2x speedup with better solution quality compared to DREAMPlace. We also plug a novel Fourier neural network into Xplace as an extension to further improve the solution quality. We believe this work not only proposes a new, fast, extensible placement framework but also illustrates a possibility to incorporate a neural network component into a GPU accelerated analytical placer.
AB - Placement serves as a fundamental step in VLSI physical design. Recently, GPU-based global placer DREAMPlace[1] demonstrated its superiority over CPU-based global placers. In this work, we develop an extremely fast GPU accelerated global placer Xplace which achieves around 2x speedup with better solution quality compared to DREAMPlace. We also plug a novel Fourier neural network into Xplace as an extension to further improve the solution quality. We believe this work not only proposes a new, fast, extensible placement framework but also illustrates a possibility to incorporate a neural network component into a GPU accelerated analytical placer.
UR - http://www.scopus.com/inward/record.url?scp=85137430923&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85137430923&partnerID=8YFLogxK
U2 - 10.1145/3489517.3530485
DO - 10.1145/3489517.3530485
M3 - Conference contribution
AN - SCOPUS:85137430923
T3 - Proceedings - Design Automation Conference
SP - 1309
EP - 1314
BT - Proceedings of the 59th ACM/IEEE Design Automation Conference, DAC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 10 July 2022 through 14 July 2022
ER -