Networks-on-Chip (NoCs) have been proposed to facilitate communication between the many cores present on a single chip. One important factor to consider when designing certain NoCs, such as the generalized hypercube, is the large wiring area requirement. The contributions of this paper are fourfold. First, a special interconnect sizing methodology is introduced and analyzed in the context of a 2D generalized-hypercube network. It is found that if the interconnects in a hypercube network are sized ideally, it would require roughly half the area that the default, single-wire-width case requires. Furthermore, factoring in the real world scenario where only a few distinct wire widths are available, the methodology presented in this paper would still save ≈ 35% of the wiring area. Second, interconnects constructed using two discrete wire widths are proposed. Using this dual-width sizing optimization, a 46% reduction in aggregate wiring area can be achieved. Third, the trade-off between wiring area and interconnect power dissipation has been quantified. Because it typically takes more repeaters to achieve the same delay with a thinner interconnect, these repeaters will cause the power consumption to increase. It is found that the sizing reduction causes a 33% link power increase for the ideal case. Lastly, it is shown that network topologies cannot be reliably compared without using the sizing methodologies shown in this paper.