Wireless power transfer at chip scale

Songbin Gong (Inventor), Yansong Yang (Inventor), Justin Postma (Inventor), Liuqing Gao (Inventor), Brandon E. Arakawa (Inventor)

Research output: Patent

Abstract

An inductive wireless power transfer apparatus includes a source coil coupled to a power source such that current flows through the source coil when the source coil is excited by the power source. The apparatus further includes a first capacitor coupled in series to the source coil. The apparatus further includes an intermediate coil surrounding the source coil and positioned within an identical plane as the source coil, and a second capacitor coupled in series to the intermediate coil. The capacitances of the first capacitor and the second capacitor are set to tune out self-inductances of the source coil and the intermediate coil. In embodiments, the source coil is to inductively power the intermediate coil, which is to inductively power a load coil positioned a distance away from the intermediate coil.
Original languageEnglish (US)
U.S. patent number11211820
Filing date5/14/18
StatePublished - Dec 28 2021

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