@inproceedings{c1edc2af394a4628a34c8c667ba185d0,
title = "Wire shaping is practical",
abstract = "Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using non-uniform wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping methodology. Non-uniform wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing OPC technology to accurately print non-uniform wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and non-uniform wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.",
keywords = "Interconnect, Manufacturing for design, OPC, Power minimization, Wire tapering",
author = "Hongbo Zhang and Wong, {Martin D.F.} and Chao, {Kai Yuan} and Liang Deng",
year = "2009",
doi = "10.1145/1514932.1514961",
language = "English (US)",
isbn = "9781605584492",
series = "Proceedings of the International Symposium on Physical Design",
pages = "131--138",
booktitle = "Proceedings of the 2009 International Symposium on Physical Design, ISPD'09",
note = "2009 International Symposium on Physical Design, ISPD'09 ; Conference date: 29-03-2009 Through 01-04-2009",
}