WeldMon: A Cost-effective Ultrasonic Welding Machine Condition Monitoring System

Beitong Tian, Ahmadreza Eslaminia, Kuan Chieh Lu, Yaohui Wang, Chenhui Shao, Klara Nahrstedt

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultrasonic welding machines play a critical role in the lithium battery industry, facilitating the bonding of batteries with conductors. Ensuring high-quality welding is vital, making tool condition monitoring systems essential for early-stage quality control. However, existing monitoring methods face challenges in cost, downtime, and adaptability. In this paper, we present WeldMon, an affordable ultrasonic welding machine condition monitoring system that utilizes a custom data acquisition system and a data analysis pipeline designed for real-time analysis. Our classification algorithm combines auto-generated features and hand-crafted features, achieving superior cross-validation accuracy (95.8% on average over all testing tasks) compared to the state-of-the-art method (92.5%) in condition classification tasks. Our data augmentation approach alleviates the dataset shift problem, enhancing tool condition classification accuracy by 8.3%. All algorithms run locally, requiring only 385 milliseconds to process data for each welding cycle. We deploy WeldMon and a commercial system on an actual ultrasonic welding machine, performing a comprehensive comparison. Our findings highlight the potential for developing cost-effective, high-performance, and reliable tool condition monitoring systems.

Original languageEnglish (US)
Title of host publication2023 IEEE 14th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023
EditorsSatyajit Chakrabarti, Rajashree Paul
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages310-319
Number of pages10
ISBN (Electronic)9798350304138
DOIs
StatePublished - 2023
Event14th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023 - New York, United States
Duration: Oct 12 2023Oct 14 2023

Publication series

Name2023 IEEE 14th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023

Conference

Conference14th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023
Country/TerritoryUnited States
CityNew York
Period10/12/2310/14/23

Keywords

  • Data Acquisition System
  • Dataset Shift
  • Edge Computing
  • Industrial Internet of Things
  • Tool Condition Monitoring
  • Ultrasonic Welding

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Computer Vision and Pattern Recognition
  • Information Systems and Management
  • Electrical and Electronic Engineering

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