Water immersion cooling of high power density electronics

Keyphrases

• Boiling Regimes 20%
• Conducting Cooling 20%
• Conformal Layer 20%
• Convective Heat Transfer Coefficient 20%
• Cooling Medium 20%
• Cooling Water 20%
• Critical Heat Flux 20%
• Deionized Water 20%
• Densification 20%
• Design Guidelines 20%
• Dielectric 20%
• Dielectric Fluid 20%
• Electrically Conducting 20%
• Electrically Insulating 40%
• Electronic Components 40%
• Electronic Devices 20%
• Electronics Cooling 20%
• Ethylene Glycol 20%
• Flow Boiling 20%
• Fluid Temperature 20%
• GaN HEMT 20%
• Heat Convection 20%
• Heat Flux 40%
• Heat Source 20%
• Heat Transfer 20%
• Heat Transfer Coefficient 20%
• High Performance 20%
• High Power Density 100%
• Hydrodynamic Instability 20%
• Immersion Cooling 100%
• Immersion Cooling System 20%
• In(III) 20%
• Insulating Coating 20%
• Latent Heat 20%
• Low Boiling Point 20%
• Mounting Methods 20%
• Natural Convection 20%
• Novec 20%
• Nucleate Boiling 20%
• Parylene C 20%
• Parylene C Coating 20%
• Power Converter 20%
• Power Electronic Systems 20%
• Printed Circuit Board 20%
• Single-phase Immersion Cooling 20%
• Surface Tension 20%
• Surrounding Waters 20%
• Temperature Difference 20%
• Thermal Conductivity 20%
• Thermal Interface Materials 20%
• Thermal Management 20%
• Thermal Pad 20%
• Thermophysical Properties 20%
• Two-phase Cooling 20%
• Water Immersion 100%
• Water-glycol 20%

Engineering

• Actuator 33%
• Boiling Point 33%
• Convection Heat Transfer Coefficient 33%
• Cooling System 33%
• Densification 33%
• Design Guideline 33%
• Dielectric Fluid 33%
• Dielectrics 33%
• Fluid Temperature 33%
• Heat Flux 100%
• Heat Source 33%
• Heat Transfer Coefficient 33%
• Hot Spot 33%
• Hydrodynamics 33%
• Latent Heat 33%
• Material Interface 33%
• Natural Convection 33%
• Nitride 33%
• Power Converter 33%
• Power Density 100%
• Power Electronics 33%
• Printed Circuit Board 33%
• Proof-of-Concept 33%
• Thermal Conductivity 33%

Material Science

• Density 100%
• Dielectric Material 66%
• Electronic Circuit 33%
• Electronic Component 100%
• Gallium Nitride 33%
• Hydrodynamics 33%
• Interface (Material) 33%
• Natural Convection 33%
• Surface Tension 33%
• Thermal Conductivity 33%
• Thermophysical Property 33%
• Transistor 33%