Water immersion cooling of high power density electronics

Physics & Astronomy

• water immersion 100%
• radiant flux density 59%
• cooling 44%
• water 37%
• electronics 34%
• submerging 29%
• boiling 29%
• heat flux 19%
• fluids 17%
• heat transfer coefficients 15%
• power converters 11%
• coatings 9%
• printed circuits 9%
• latent heat 8%
• circuit boards 8%
• cooling systems 8%
• gallium nitrides 8%
• thermophysical properties 8%
• mounting 8%
• heat sources 8%
• glycols 7%
• packaging 7%
• free convection 7%
• densification 7%
• ethylene 7%
• interfacial tension 6%
• temperature gradients 6%
• convection 6%
• transistors 5%
• thermal conductivity 5%
• heat transfer 5%
• hydrodynamics 5%
• conduction 4%
• electric potential 3%
• liquids 3%
• performance 3%

Engineering & Materials Science

• Cooling water 73%
• Electronic equipment 55%
• Cooling 45%
• Boiling liquids 25%
• Fluids 21%
• Heat transfer coefficients 15%
• Coatings 12%
• Thermal management (electronics) 12%
• Hot Temperature 11%
• Boiling point 10%
• Densification 9%
• Latent heat 9%
• Surface tension 8%
• Mountings 8%
• Natural convection 8%
• Power converters 8%
• Printed circuit boards 8%
• Cooling systems 8%
• Power electronics 7%
• Thermodynamic properties 7%
• Thermal conductivity 7%
• Packaging 7%
• Hydrodynamics 7%
• Transistors 7%
• Heat transfer 5%
• Liquids 5%
• Electric potential 4%
• Temperature 3%

Chemical Compounds

• Cooling 58%
• Heat 24%
• Heat Transfer 21%
• Boiling 13%
• Convective Heat Transfer 10%
• Densification 7%
• Nitride 6%
• Hydrodynamics 6%
• Thermodynamic Property 5%
• Volume 3%
• Liquid 3%
• Mixture 2%