Viscoelastic ink for direct writing of hydrogel structures

Robert F. Shepherd; Robert A. Barry; Sara T. Parker; Jennifer N. Shepherd; Ralph G Nuzzo; Jennifer Lewis; Pierre Wiltzius

Viscoelastic ink for direct writing of hydrogel structures

Robert F. Shepherd (Inventor)
, Robert A. Barry (Inventor)
, Sara T. Parker (Inventor)
, Jennifer N. Shepherd (Inventor)
, Ralph G Nuzzo (Inventor)
, Jennifer Lewis (Inventor)
, Pierre Wiltzius (Inventor)

Research output: Patent

Abstract

A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.

Original language	English (US)
U.S. patent number	9045657
Filing date	3/22/11
State	Published - Jun 2 2015

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title = "Viscoelastic ink for direct writing of hydrogel structures",

abstract = "A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.",

author = "Shepherd, \{Robert F.\} and Barry, \{Robert A.\} and Parker, \{Sara T.\} and Shepherd, \{Jennifer N.\} and Nuzzo, \{Ralph G\} and Jennifer Lewis and Pierre Wiltzius",

note = "FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The subject matter of the present disclosure was supported by the Wm. Keck Foundation, Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems (contract no. DMI-0328162), National Science Foundation (contract no. CHE-07-4153), U.S. Army Research Office (contract no. DAAD19-03-1-0227) and the National Institutes of Health (contract nos. MH085220 and R01 EY01736-01A1). The government has certain rights in the invention.; 9045657",

year = "2015",

month = jun,

day = "2",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Viscoelastic ink for direct writing of hydrogel structures

AU - Shepherd, Robert F.

AU - Barry, Robert A.

AU - Parker, Sara T.

AU - Shepherd, Jennifer N.

AU - Nuzzo, Ralph G

AU - Lewis, Jennifer

AU - Wiltzius, Pierre

N1 - FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The subject matter of the present disclosure was supported by the Wm. Keck Foundation, Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems (contract no. DMI-0328162), National Science Foundation (contract no. CHE-07-4153), U.S. Army Research Office (contract no. DAAD19-03-1-0227) and the National Institutes of Health (contract nos. MH085220 and R01 EY01736-01A1). The government has certain rights in the invention.

PY - 2015/6/2

Y1 - 2015/6/2

N2 - A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.

AB - A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.

M3 - Patent

M1 - 9045657

Y2 - 2011/03/22

ER -

Viscoelastic ink for direct writing of hydrogel structures

Abstract

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