TY - GEN
T1 - Virtual Reality, Visual Cliffs, and Movement Disorders
AU - Kaur, Rachneet
AU - Lin, Xun
AU - Layton, Alexander
AU - Hernandez, Manuel
AU - Sowers, Richard
N1 - IX. ACKNOWLEDGEMENTS This work would not have been possible without the support of the the Illinois Geometry Laboratory of the Department of Mathematics at the University of Illinois. The authors would like to especially acknowledge the work of Martin Bantchev, Vivek Kaushik, Yiyang Kong, Daan Michiels, Linchen Wang, Jiaying Wu, and Pengzheng Zhang.
PY - 2018/10/26
Y1 - 2018/10/26
N2 - We outline an experimental setup designed to dynamically understand neural responses to visual cliffs while walking. The goal of our work is understanding and mitigating fear of falling, particularly among the elderly. In our setup, an EEG cap monitors a subject's neural activity while the subject is immersed in a virtual world and walking on an instrumented treadmill. The subject's response to visual stimuli is measured by both the EEG cap and by speed and pressure data from the treadmill. Based on this data, we can dynamically alter the landscape in the virtual world. We hope that our setup may be useful in helping subjects develop mechanisms to compensate for significant fear of falling while walking.
AB - We outline an experimental setup designed to dynamically understand neural responses to visual cliffs while walking. The goal of our work is understanding and mitigating fear of falling, particularly among the elderly. In our setup, an EEG cap monitors a subject's neural activity while the subject is immersed in a virtual world and walking on an instrumented treadmill. The subject's response to visual stimuli is measured by both the EEG cap and by speed and pressure data from the treadmill. Based on this data, we can dynamically alter the landscape in the virtual world. We hope that our setup may be useful in helping subjects develop mechanisms to compensate for significant fear of falling while walking.
UR - http://www.scopus.com/inward/record.url?scp=85056619362&partnerID=8YFLogxK
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U2 - 10.1109/EMBC.2018.8512246
DO - 10.1109/EMBC.2018.8512246
M3 - Conference contribution
C2 - 30440346
AN - SCOPUS:85056619362
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 81
EP - 84
BT - 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018
Y2 - 18 July 2018 through 21 July 2018
ER -