TY - GEN
T1 - VARIUS-NTV
T2 - 42nd Annual IEEE/IFIP International Conference on Dependable Systems and Networks, DSN 2012
AU - Karpuzcu, Ulya R.
AU - Kolluru, Krishna B.
AU - Kim, Nam Sung
AU - Torrellas, Josep
PY - 2012
Y1 - 2012
N2 - Near-Threshold Computing (NTC), where the supply voltage is only slightly higher than the threshold voltage of transistors, is a promising approach to attain energy-efficient computing. Unfortunately, compared to the conventional Super-Threshold Computing (STC), NTC is more sensitive to process variations, which results in higher power consumption and lower frequencies than would otherwise be possible, and potentially a non-negligible fault rate. To help address variations at NTC at the architecture level, this paper presents the first microarchitectural model of process variations for NTC. The model, called VARIUS-NTV, extends the existing VARIUS variation model. Its key aspects include: (i) adopting a gate-delay model and an SRAM cell type that are tailored to NTC, (ii) modeling SRAM failure modes emerging at NTC, and (iii) accounting for the impact of leakage in SRAM models. We evaluate a simulated 11nm, 288-core tiled manycore at both NTC and STC. The results show higher frequency and power variations within the NTC chip. For example, the maximum difference in on-chip tile frequency is 2.3× at STC and 3.7× at NTC. We also validate our model against an experimental chip.
AB - Near-Threshold Computing (NTC), where the supply voltage is only slightly higher than the threshold voltage of transistors, is a promising approach to attain energy-efficient computing. Unfortunately, compared to the conventional Super-Threshold Computing (STC), NTC is more sensitive to process variations, which results in higher power consumption and lower frequencies than would otherwise be possible, and potentially a non-negligible fault rate. To help address variations at NTC at the architecture level, this paper presents the first microarchitectural model of process variations for NTC. The model, called VARIUS-NTV, extends the existing VARIUS variation model. Its key aspects include: (i) adopting a gate-delay model and an SRAM cell type that are tailored to NTC, (ii) modeling SRAM failure modes emerging at NTC, and (iii) accounting for the impact of leakage in SRAM models. We evaluate a simulated 11nm, 288-core tiled manycore at both NTC and STC. The results show higher frequency and power variations within the NTC chip. For example, the maximum difference in on-chip tile frequency is 2.3× at STC and 3.7× at NTC. We also validate our model against an experimental chip.
KW - Manycore architectures
KW - Near-threshold voltage
KW - Power constraints
KW - Process variations
KW - SRAM fault models
UR - http://www.scopus.com/inward/record.url?scp=84866660547&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84866660547&partnerID=8YFLogxK
U2 - 10.1109/DSN.2012.6263951
DO - 10.1109/DSN.2012.6263951
M3 - Conference contribution
AN - SCOPUS:84866660547
SN - 9781467316248
T3 - Proceedings of the International Conference on Dependable Systems and Networks
BT - 2012 42nd Annual IEEE/IFIP International Conference on Dependable Systems and Networks, DSN 2012
Y2 - 25 June 2012 through 28 June 2012
ER -