TY - GEN
T1 - Variation aware routing for three-dimensional FPGAs
AU - Dong, Chen
AU - Chilstedt, Scott
AU - Chen, Deming
PY - 2009
Y1 - 2009
N2 - To maximize the potential of three-dimensional integrated circuit architectures, 3D CAD tools must be developed that are on-par with their 2D counterparts. In this paper, we present a statistical static timing analysis (SSTA) engine designed to deal with both the uncorrelated and correlated variations in 3D FPGAs. We consider the effects of intra-die and inter-die variation. Using the 3D physical design tool TPR as a base, we develop a new 3D routing algorithm which improves the average performance of two layer designs by over 22% and three layer designs by over 27%. To the best of our knowledge, this is the first physical design tool to consider variation in the routing and timing analysis of 3D FPGAs.
AB - To maximize the potential of three-dimensional integrated circuit architectures, 3D CAD tools must be developed that are on-par with their 2D counterparts. In this paper, we present a statistical static timing analysis (SSTA) engine designed to deal with both the uncorrelated and correlated variations in 3D FPGAs. We consider the effects of intra-die and inter-die variation. Using the 3D physical design tool TPR as a base, we develop a new 3D routing algorithm which improves the average performance of two layer designs by over 22% and three layer designs by over 27%. To the best of our knowledge, this is the first physical design tool to consider variation in the routing and timing analysis of 3D FPGAs.
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U2 - 10.1109/ISVLSI.2009.44
DO - 10.1109/ISVLSI.2009.44
M3 - Conference contribution
AN - SCOPUS:70349484062
SN - 9780769536842
T3 - Proceedings of the 2009 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2009
SP - 298
EP - 303
BT - Proceedings of the 2009 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2009
T2 - 2009 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2009
Y2 - 14 May 2009 through 15 May 2009
ER -