Abstract
A backface strain technique is introduced to detect fatigue crack initiation in solder lap joints. The technique detects the fatigue crack initiation by monitoring the backface strain at the end of the overlap. Variation of the backface strain with the development of a crack was simulated by finite element method. The simulation indicated that the backface strain at the end of the overlap reached a peak when a fatigue crack initiated. Fatigue experiments were conducted in solder joints, and the backface strain was recorded as a function of stress cycle, to demonstrate the applicability of the technique.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 5 |
| Number of pages | 1 |
| Journal | American Society of Mechanical Engineers (Paper) |
| State | Published - Dec 1 1995 |
| Event | Proceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA Duration: Nov 12 1995 → Nov 17 1995 |
ASJC Scopus subject areas
- Mechanical Engineering