Use of backface strain to monitor fatigue crack initiation in solder joints

Zhehua Zhang, Daping Yao, J. K. Shang

Research output: Contribution to journalConference articlepeer-review

Abstract

A backface strain technique is introduced to detect fatigue crack initiation in solder lap joints. The technique detects the fatigue crack initiation by monitoring the backface strain at the end of the overlap. Variation of the backface strain with the development of a crack was simulated by finite element method. The simulation indicated that the backface strain at the end of the overlap reached a peak when a fatigue crack initiated. Fatigue experiments were conducted in solder joints, and the backface strain was recorded as a function of stress cycle, to demonstrate the applicability of the technique.

Original languageEnglish (US)
Pages (from-to)5
Number of pages1
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - Dec 1 1995
EventProceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA
Duration: Nov 12 1995Nov 17 1995

ASJC Scopus subject areas

  • Mechanical Engineering

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