Ultra-Small, High-Frequency, and Substrate-Immune Microtube Inductors Transformed from 2D to 3D

Keyphrases

• Microtube 100%
• Inductors 100%
• 2D to 3D 100%
• Ultrasmall 100%
• Self-rolled-up 75%
• Radio-frequency Integrated Circuit (RF IC) 75%
• SiNx 50%
• Planar Inductor 50%
• Order of Magnitude 25%
• Performance Improvement 25%
• Strain-induced 25%
• Nanotechnology 25%
• On chip 25%
• Silicon Nitride 25%
• Weak Dependence 25%
• Miniaturization 25%
• Inductance 25%
• High-frequency Operation 25%
• Global Solution 25%
• Passive Devices 25%
• High-frequency Performance 25%
• Future Demand 25%
• Small Footprint 25%
• Sacrificial Layer 25%
• Serpentine 25%
• Strained Silicon 25%
• On-chip Inductor 25%
• Operation Frequency 25%
• On-wafer 25%
• Transistor Technology 25%
• Wireless Communication Systems 25%
• Quality Factor (Q-factor) 25%
• Sprawl 25%
• Metal Strip 25%
• Integrated Circuit chip 25%
• Hollow Tubular Structure 25%
• Circuit Miniaturization 25%
• 3D Hollow 25%
• Substrate Conductivity 25%
• Continuous Scaling 25%

Engineering

• Microtube 100%
• Radio Frequency 100%
• Integrated Circuit 100%
• Frequency Operation 66%
• Q Factor 66%
• Nitride 33%
• Communication System 33%
• Passive Device 33%
• Wireless Communication 33%
• Platform Nanotechnology 33%

Material Science

• Electronic Circuit 100%
• Transistor 33%
• Silicon Nitride 33%
• Strained Silicon 33%
• Strip Metal 33%