TY - GEN
T1 - Turbo-SPICE with Latency Insertion Method (LIM)
AU - Zhichao, Deng
AU - Schutt-Ainé, J. E.
PY - 2005
Y1 - 2005
N2 - In this work, the latency insertion method (LIM) for the time-domain simulation of networks is incorporated into SPICE3f5 for the faster simulation of power distribution networks. This integration is done so as to provide an accelerating option for simulation and an alternative to the resident modified nodal analysis (MNA) in SPICE. Since LIM has linear computational complexity and is substantially faster than SPICE, the new LIM-SPICE simulator allows to handle much larger networks while using the same SPICE framework. In addition, mutual inductance are handled by utilizing a K matrix formulation.
AB - In this work, the latency insertion method (LIM) for the time-domain simulation of networks is incorporated into SPICE3f5 for the faster simulation of power distribution networks. This integration is done so as to provide an accelerating option for simulation and an alternative to the resident modified nodal analysis (MNA) in SPICE. Since LIM has linear computational complexity and is substantially faster than SPICE, the new LIM-SPICE simulator allows to handle much larger networks while using the same SPICE framework. In addition, mutual inductance are handled by utilizing a K matrix formulation.
UR - http://www.scopus.com/inward/record.url?scp=33845901773&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33845901773&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2005.1563772
DO - 10.1109/EPEP.2005.1563772
M3 - Conference contribution
AN - SCOPUS:33845901773
SN - 0780392205
SN - 9780780392205
T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging
SP - 329
EP - 332
BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Y2 - 24 October 2005 through 26 October 2005
ER -