Turbo-SPICE with Latency Insertion Method (LIM)

Deng Zhichao, Jose E Schutt-Aine

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, the latency insertion method (LIM) for the time-domain simulation of networks is incorporated into SPICE3f5 for the faster simulation of power distribution networks. This integration is done so as to provide an accelerating option for simulation and an alternative to the resident modified nodal analysis (MNA) in SPICE. Since LIM has linear computational complexity and is substantially faster than SPICE, the new LIM-SPICE simulator allows to handle much larger networks while using the same SPICE framework. In addition, mutual inductance are handled by utilizing a K matrix formulation.

Original languageEnglish (US)
Title of host publication14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages329-332
Number of pages4
DOIs
StatePublished - Dec 1 2005
Event14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States
Duration: Oct 24 2005Oct 26 2005

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume2005

Other

Other14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/TerritoryUnited States
CityAustin, TX
Period10/24/0510/26/05

ASJC Scopus subject areas

  • Engineering(all)

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