Tunneling—Percolation behavior of graphene-encapsulated whiskers as electroconductive fillers for ceramics

Irina Hussainova, Roman Ivanov, S. Sudhir Kale, Iwona M Jasiuk

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

A direct single-step catalyst-free CVD technique has been used for producing alumina nano-whiskers covered by a few layers of defective graphene. The hybrid whiskers have been then exploited as electroconductive fillers to oxide ceramics. The electrically conductive additives do not substantially change the mechanical properties. However, the resistivity of the composites undergoes a considerable drop turning the dielectric oxides into conductive composites by addition of 2 vol% of fillers. Three-dimensional Monte Carlo simulation of systems of polydisperse prolate ellipsoids, using the critical path based tunneling-percolation model, has been exploiting for estimation of a tunnelling length-scale. The value of percolation threshold is found to be 2.23 nm for the materials under consideration, with is in a good agreement with experimental data.

Original languageEnglish (US)
Title of host publicationAdvanced Structured Materials
PublisherSpringer-Verlag
Pages131-139
Number of pages9
DOIs
StatePublished - Jan 1 2019

Publication series

NameAdvanced Structured Materials
Volume95
ISSN (Print)1869-8433
ISSN (Electronic)1869-8441

Fingerprint

Graphite
Oxides
Graphene
Fillers
Phosmet
Aluminum Oxide
Composite materials
Chemical vapor deposition
Alumina
Mechanical properties
Catalysts
Monte Carlo simulation

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Hussainova, I., Ivanov, R., Sudhir Kale, S., & Jasiuk, I. M. (2019). Tunneling—Percolation behavior of graphene-encapsulated whiskers as electroconductive fillers for ceramics. In Advanced Structured Materials (pp. 131-139). (Advanced Structured Materials; Vol. 95). Springer-Verlag. https://doi.org/10.1007/978-3-030-00868-0_9

Tunneling—Percolation behavior of graphene-encapsulated whiskers as electroconductive fillers for ceramics. / Hussainova, Irina; Ivanov, Roman; Sudhir Kale, S.; Jasiuk, Iwona M.

Advanced Structured Materials. Springer-Verlag, 2019. p. 131-139 (Advanced Structured Materials; Vol. 95).

Research output: Chapter in Book/Report/Conference proceedingChapter

Hussainova, I, Ivanov, R, Sudhir Kale, S & Jasiuk, IM 2019, Tunneling—Percolation behavior of graphene-encapsulated whiskers as electroconductive fillers for ceramics. in Advanced Structured Materials. Advanced Structured Materials, vol. 95, Springer-Verlag, pp. 131-139. https://doi.org/10.1007/978-3-030-00868-0_9
Hussainova I, Ivanov R, Sudhir Kale S, Jasiuk IM. Tunneling—Percolation behavior of graphene-encapsulated whiskers as electroconductive fillers for ceramics. In Advanced Structured Materials. Springer-Verlag. 2019. p. 131-139. (Advanced Structured Materials). https://doi.org/10.1007/978-3-030-00868-0_9
Hussainova, Irina ; Ivanov, Roman ; Sudhir Kale, S. ; Jasiuk, Iwona M. / Tunneling—Percolation behavior of graphene-encapsulated whiskers as electroconductive fillers for ceramics. Advanced Structured Materials. Springer-Verlag, 2019. pp. 131-139 (Advanced Structured Materials).
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