Abstract
Neutral electron traps are generated in gate oxide during electrical stress, leading to degradation in the form of stress-induced leakage current (SILC) and eventually resulting in breakdown. SILC is the result of inelastic, trap-assisted tunneling of electrons that originate in the conduction band of the cathode. Deuterium annealing experiments call into question the interfacial hydrogen release model of the trap generation mechanism. A framework for modeling time-to-breakdown is presented.
Original language | English (US) |
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Pages (from-to) | 625-632 |
Number of pages | 8 |
Journal | Microelectronics Reliability |
Volume | 41 |
Issue number | 5 |
DOIs | |
State | Published - May 2001 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Safety, Risk, Reliability and Quality
- Surfaces, Coatings and Films
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering