Transverse isotropic elastic moduli and in-plane thermal diffusivity in silicon-supported thin films of a photosensitive polyimide measured using impulsive stimulated thermal scattering

Jennifer K. Cocson, Christine S. Hau, Peijou M. Lee, Clara C. Poon, Annita H. Zhong, John A. Rogers, Keith A. Nelson

Research output: Contribution to journalArticlepeer-review

Abstract

Through impulsive stimulated thermal scattering, the elastic and thermal properties of silicon-supported thin films (2-11 μm thicknesses) of a new low-CTE (coefficient of thermal expansion) photosensitive polyimide based on a biphenyl dianhydride/p-phenylenediamine backbone were studied. The material was found to be mechanically anisotropic. The in-plane thermal diffusivity and the in-plane and through-plane shear and longitudinal sound speeds were determined.

Original languageEnglish (US)
Pages (from-to)4069-4075
Number of pages7
JournalPolymer
Volume36
Issue number21
DOIs
StatePublished - 1995

Keywords

  • elastic/thermal properties
  • i.s.t.s. characterization
  • photosensitive thin film

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics

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