Transient simulation of lossy interconnects using the Latency Insertion Method (LIM)

Dmitri Klokotov, Jose Schutt-Ainé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work an extension of the Latency Insertion Method (LIM) formulation to the treatment of networks with frequency-dependent parameters is discussed. It is shown that the algorithm can be transformed to allow efficient simulation of both skin effect of conductors as well as frequency dependent substrate loss in high speed circuit interconnects.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 2008
Pages251-254
Number of pages4
DOIs
StatePublished - Dec 31 2008
Event17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States
Duration: Oct 27 2008Oct 29 2008

Publication series

NameElectrical Performance of Electronic Packaging, EPEP

Other

Other17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
CountryUnited States
CitySan Jose, CA
Period10/27/0810/29/08

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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