Fingerprint
Dive into the research topics of 'Transient electrical-thermal Co-simulation in the design of on-chip and 3-D interconnects'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Transient electrical-thermal Co-simulation in the design of on-chip and 3-D interconnects
Tianjian Lu, Jian Ming Jin
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution