@inproceedings{16af51f165134bea9a3a276791a1c34e,
title = "Transient electrical-thermal Co-simulation in the design of on-chip and 3-D interconnects",
abstract = "The electrical-thermal co-simulation in the transient regime is developed for the design of on-chip and 3-D interconnects. The co-simulation is based on the finite element method, of which the capability is further extended to efficiently handle large-scale problems by employing the finite element tearing and interconnecting (FETI) method and the FETI-enabled parallel computing.",
keywords = "Electrical-thermal Co-simulation, Finite element tearing and interconnecting, On-chip and 3-D interconnects",
author = "Tianjian Lu and Jin, {Jian Ming}",
year = "2015",
month = may,
day = "15",
language = "English (US)",
series = "Annual Review of Progress in Applied Computational Electromagnetics",
publisher = "Applied Computational Electromagnetics Society (ACES)",
booktitle = "2015 31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015",
note = "31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015 ; Conference date: 22-03-2015 Through 26-03-2015",
}