Transient electrical-thermal analysis of 3-D power distribution network with FETI-Enabled parallel computing

Tianjian Lu, Jian Ming Jin

Research output: Contribution to journalArticle


In this paper, the transient electrical-thermal co-simulation is implemented with the finite-element method. The capability of the co-simulation is extended to solve large-scale problems by incorporating a domain decomposition scheme called the finite element tearing and interconnecting (FETI). With the high parallel efficiency of FETI for computing with multiple processors, a significant reduction in computation time is achieved. The transient electrical-thermal behaviors of large-scale power distribution networks (PDNs), including on-chip power grids, solder bump arrays, and TSV-based PDN are simulated and analyzed with the proposed method. The impacts on the design of the PDNs from different types of input pulses, power maps, and via pitches are also investigated.

Original languageEnglish (US)
Article number6883144
Pages (from-to)1684-1695
Number of pages12
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number10
StatePublished - Oct 1 2014



  • 3-D power distribution network (PDN)
  • domain decomposition
  • electrical-thermal co-simulation
  • finite-element method (FEM)
  • through-silicon via (TSV)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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