Transfer printing of flexible hybrid inductor-capacitor filters via pre-etched silicon-on-insulator mother wafer

An approach for the processing of flexible electronics is presented. To protect the functional insulator in the structure, hybrid inductor-capacitor (LC) filters were fabricated on the pre-etched silicon-on-insulator wafer, where the selectively patterned semi-stable Si-supporting membranes were sufficiently robust to support the entire device fabrication process, yet flexible enough to facilitate the subsequent transfer printing via adhesive stamp. When the LC filters were transferred to an elastomeric substrate, 20 compressibility was achieved, giving rise to wavy deformation of the devices and up to 9 variation in the electronic properties. Beyond the 20 strain, local delamination of the films resulted in mechanical instability.