Toward Holistic Design of Spatial Packaging of Interconnected Systems with Physical Interactions (SPI2)

Satya R.T. Peddada, Lawrence E. Zeidner, Horea T. Ilies, Kai A. James, James T. Allison

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Toward Holistic Design of Spatial Packaging of Interconnected Systems with Physical Interactions (SPI2)'. Together they form a unique fingerprint.

Computer Science

Engineering

Keyphrases

Material Science