Toward a more robust and accurate CEM fast integral equation solver for IC applications

Weng Cho Chew, Li Jun Jiang, Yun Hui Chu, Gong Li Wang, I. Ting Chiang, Yuancheng Christopher Pan, Jun Sheng Zhao

Research output: Contribution to journalReview article

Abstract

We review recent advances in fast algorithms for fast integral equation solvers that are useful for IC applications. We review fast solvers for Laplace's equation, which is about 10 times faster than the conventional fast multipole method. Then we review the physics of low-frequency electromagnetics, and the relevant low-frequency method of moments. We describe a fast solver that allows us to solve over one million unknowns on a workstation recently. In addition, we demonstrate the applications of these fast integral equation solvers to the lithography problem. In addition, we propose a scheme whereby we first characterize blocks of linear circuits with network S, Y, or Z parameters. Then a fast real-time convolution scheme is used to calculate the interaction of a linear circuit with nonlinear terminations such as transistors and diodes. Such a scheme requires no model-order reduction of the circuit.

Original languageEnglish (US)
Pages (from-to)449-464
Number of pages16
JournalIEEE Transactions on Advanced Packaging
Volume28
Issue number3
DOIs
StatePublished - Aug 2005

Keywords

  • Fast real-time convolution
  • Integral equation
  • Lithography
  • Method of moments (MoM)
  • Multilevel fast multipole algorithm (MLFMA)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Chew, W. C., Jiang, L. J., Chu, Y. H., Wang, G. L., Chiang, I. T., Pan, Y. C., & Zhao, J. S. (2005). Toward a more robust and accurate CEM fast integral equation solver for IC applications. IEEE Transactions on Advanced Packaging, 28(3), 449-464. https://doi.org/10.1109/TADVP.2005.848665