Topology Optimized Fin Designs for Base Plate Direct-Cooled Multi-Chip Power Modules

Keyphrases

• Topology Optimization 100%
• Base Plate 100%
• Fin Design 100%
• Multi-chip Power Module 100%
• Coolant 40%
• Direct Cooling 40%
• Module Base 40%
• Finning 40%
• High Performance 20%
• Three-dimensional (3D) 20%
• Operating Conditions 20%
• Two Dimensional 20%
• Fluid Flow 20%
• Silicon Carbide 20%
• Thermal Interface Materials 20%
• Two-layer 20%
• Design Methodology 20%
• Design Optimization 20%
• Thermal Resistance 20%
• Pressure Drop 20%
• Heat Dissipation 20%
• Semiconductor Technology 20%
• ChIP-chip 20%
• Heat Fluid 20%
• Temperature Difference 20%
• Thermal Performance 20%
• Flow Simulation 20%
• Board Power 20%
• Inlet Temperature 20%
• Coolant Flow Rate 20%
• Hydraulic Performance 20%
• Conjugate Heat Transfer 20%
• Heat Transfer Flow 20%
• Thermal-hydraulic Performance 20%
• Plate Design 20%
• Wide Band Gap Semiconductors 20%
• Topology Optimization Algorithm 20%
• Chip Temperature 20%
• Plate Fin 20%
• Silicon Carbide Devices 20%
• Power Module 20%
• Power Platform 20%
• Power Converter System 20%

Engineering

• Baseplate 100%
• Direct Cooling 40%
• Two Dimensional 20%
• Flow Rate 20%
• Material Interface 20%
• Optimised Design 20%
• Hydraulics 20%
• Pressure Drop 20%
• Heat Losses 20%
• Power Converter 20%
• Thermal Performance 20%
• Inlet Temperature 20%
• Coolant Flow 20%
• Thermal Hydraulics 20%
• Wide Bandgap Semiconductor 20%
• Fluid Flows Numerical Simulation 20%
• Flow Velocity 20%
• Heat Resistance 20%