@article{ceab2a90943f4692bcad1f0f0b391f1d,
title = "Topical special issue on the electrical performance of packages and interconnects",
author = "Jos{\'e} Schutt-Ain{\'e}",
note = "Funding Information: Dr. Schutt-Ain{\'e} has received several research awards including the NSF MRI Award in 1991, the NASA Faculty Award for Research in 1992, the NSF MCAA Award in 1996, and the UIUC-NCSA Faculty Fellow in 2000. He is currently serving as Editor-in-Chief of the IEEE TRANSACTIONS ON ADVANCED PACKAGING.",
year = "2007",
month = may,
doi = "10.1109/TADVP.2007.900164",
language = "English (US)",
volume = "30",
pages = "162",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",
}