Topical special issue on the electrical performance of packages and interconnects

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish (US)
Number of pages1
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number2
DOIs
StatePublished - May 1 2007

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

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