TY - GEN
T1 - Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations
AU - Li, Xiaolei
AU - Jin, Jian Ming
AU - Tan, Jilin
PY - 2011/12/1
Y1 - 2011/12/1
N2 - As the operating frequency and integration level of integrated circuits (IC) increase, full-wave analysis algorithms are needed to accurately simulate the arising electromagnetic phenomena. The finite-element time-domain (FETD) method has become an attractive candidate for this simulation due to its advantages in modeling complex geometries and materials, conducting transient analyses, and performing broadband characterizations. Three FETD-based numerical algorithms, including the original FETD method, the dual-field domain-decomposition (DFDD) method, and the discontinuous Galerkin time-domain (DGTD) method, are investigated and applied to the simulation of printed circuit board (PCB) structures to demonstrate their accuracies and capabilities.
AB - As the operating frequency and integration level of integrated circuits (IC) increase, full-wave analysis algorithms are needed to accurately simulate the arising electromagnetic phenomena. The finite-element time-domain (FETD) method has become an attractive candidate for this simulation due to its advantages in modeling complex geometries and materials, conducting transient analyses, and performing broadband characterizations. Three FETD-based numerical algorithms, including the original FETD method, the dual-field domain-decomposition (DFDD) method, and the discontinuous Galerkin time-domain (DGTD) method, are investigated and applied to the simulation of printed circuit board (PCB) structures to demonstrate their accuracies and capabilities.
KW - Integrated circuit
KW - domain decomposition
KW - finite element method
KW - printed circuit board
KW - time domain analysis
UR - http://www.scopus.com/inward/record.url?scp=84855374467&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84855374467&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2011.6100245
DO - 10.1109/EPEPS.2011.6100245
M3 - Conference contribution
AN - SCOPUS:84855374467
SN - 9781424493999
T3 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
SP - 275
EP - 278
BT - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
T2 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Y2 - 23 October 2011 through 26 October 2011
ER -