Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations

Xiaolei Li, Jian Ming Jin, Jilin Tan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

As the operating frequency and integration level of integrated circuits (IC) increase, full-wave analysis algorithms are needed to accurately simulate the arising electromagnetic phenomena. The finite-element time-domain (FETD) method has become an attractive candidate for this simulation due to its advantages in modeling complex geometries and materials, conducting transient analyses, and performing broadband characterizations. Three FETD-based numerical algorithms, including the original FETD method, the dual-field domain-decomposition (DFDD) method, and the discontinuous Galerkin time-domain (DGTD) method, are investigated and applied to the simulation of printed circuit board (PCB) structures to demonstrate their accuracies and capabilities.

Original languageEnglish (US)
Title of host publication2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Pages275-278
Number of pages4
DOIs
StatePublished - Dec 1 2011
Event2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 - San Jose, CA, United States
Duration: Oct 23 2011 → Oct 26 2011

Publication series

Name2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011

Other

Other2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
CountryUnited States
CitySan Jose, CA
Period10/23/11 → 10/26/11

Keywords

  • Integrated circuit
  • domain decomposition
  • finite element method
  • printed circuit board
  • time domain analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Li, X., Jin, J. M., & Tan, J. (2011). Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations. In 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 (pp. 275-278). [6100245] (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011). https://doi.org/10.1109/EPEPS.2011.6100245