Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards

Keyphrases

• Three-dimensional (3D) 100%
• Woven Composites 100%
• Composite Substrate 100%
• Multilayer Circuit Boards 100%
• Viscoelastic Flow Simulation 100%
• Creep Compliance 50%
• Viscoelastic Properties 50%
• Geometrical Model 50%
• Deformation Field 50%
• Numerical Prediction 50%
• Multilayer Printed Circuit Board 50%
• Accurate Characterization 50%
• Elastic Model 50%
• Inhomogeneous Deformation 50%
• Viscoelastic Model 50%
• Plain Woven Composites 50%
• Numerical Work 50%
• Woven Fabric 50%
• Dimensionally Stable 50%
• Flexural Deformation 50%

Engineering

• Experimental Observation 100%
• Printed Circuit Board 100%
• Creep 100%
• Deformation Field 100%
• Numerical Prediction 100%
• Inhomogeneous Deformation 100%

Material Science

• Electronic Circuit 100%
• Creep 50%