Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards

Qi Zhu; Pranav Shrotriya; Nancy R. Sottos; Philippe H. Geubelle

doi:10.1016/S0266-3538(03)00171-4

Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards

Qi Zhu, Pranav Shrotriya, Nancy R. Sottos, Philippe H. Geubelle

Research output: Contribution to journal › Article › peer-review

Abstract

Viscoelastic properties of woven composite substrates are essential to design dimensionally stable multilayer printed circuit boards. Unlike most existing numerical work which rely on simplified constitutive (elastic) and geometrical models, this study involves a fully three-dimensional viscoelastic model of a plain weave composite with accurate characterization of the woven geometry. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on the time-dependent flexural deformations of the woven fabric bundles. Predictions of the inhomogeneous deformation fields over the repeating cell agree with experimental observations.

Original language	English (US)
Pages (from-to)	1971-1983
Number of pages	13
Journal	Composites Science and Technology
Volume	63
Issue number	13
DOIs	https://doi.org/10.1016/S0266-3538(03)00171-4
State	Published - Oct 2003

Keywords

Woven composites

ASJC Scopus subject areas

General Engineering
Ceramics and Composites

Online availability

10.1016/S0266-3538(03)00171-4

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title = "Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards",

abstract = "Viscoelastic properties of woven composite substrates are essential to design dimensionally stable multilayer printed circuit boards. Unlike most existing numerical work which rely on simplified constitutive (elastic) and geometrical models, this study involves a fully three-dimensional viscoelastic model of a plain weave composite with accurate characterization of the woven geometry. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on the time-dependent flexural deformations of the woven fabric bundles. Predictions of the inhomogeneous deformation fields over the repeating cell agree with experimental observations.",

keywords = "Woven composites",

author = "Qi Zhu and Pranav Shrotriya and Sottos, {Nancy R.} and Geubelle, {Philippe H.}",

note = "Funding Information: The authors gratefully acknowledge the support of NSF (grant No. DMI 96-10382) and of the Motorola Advanced Technology Group, Motorola Labs, Dr. A.F. Skipor, technical supervisor. ",

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AU - Zhu, Qi

AU - Shrotriya, Pranav

AU - Sottos, Nancy R.

AU - Geubelle, Philippe H.

N1 - Funding Information: The authors gratefully acknowledge the support of NSF (grant No. DMI 96-10382) and of the Motorola Advanced Technology Group, Motorola Labs, Dr. A.F. Skipor, technical supervisor.

PY - 2003/10

Y1 - 2003/10

N2 - Viscoelastic properties of woven composite substrates are essential to design dimensionally stable multilayer printed circuit boards. Unlike most existing numerical work which rely on simplified constitutive (elastic) and geometrical models, this study involves a fully three-dimensional viscoelastic model of a plain weave composite with accurate characterization of the woven geometry. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on the time-dependent flexural deformations of the woven fabric bundles. Predictions of the inhomogeneous deformation fields over the repeating cell agree with experimental observations.

AB - Viscoelastic properties of woven composite substrates are essential to design dimensionally stable multilayer printed circuit boards. Unlike most existing numerical work which rely on simplified constitutive (elastic) and geometrical models, this study involves a fully three-dimensional viscoelastic model of a plain weave composite with accurate characterization of the woven geometry. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on the time-dependent flexural deformations of the woven fabric bundles. Predictions of the inhomogeneous deformation fields over the repeating cell agree with experimental observations.

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Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards

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