Three-dimensional profiler for performance evaluation of chip seals

Arash Motamed; Satyavati Komaragiri; Angelo Filonzi; Ramez Hajj; Amit Bhasin

Three-dimensional profiler for performance evaluation of chip seals

Arash Motamed, Satyavati Komaragiri, Angelo Filonzi, Ramez Hajj, Amit Bhasin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Chip seals are a very important and commonly used tool to preserve and extend the life of flexible pavements and restore skid resistance, particularly for pavements with low to medium traffic volume. Despite its wide spread use, there is lack of quantitative, rapid and objective methods to quantify the quality of chip seals in the laboratory as well as in the field. This paper demonstrates the feasibility of using a three-dimensional laser profiler to measure metrics that can be used to assess the quality and performance of chip seals, particularly embedment depth.

Original language	English (US)
Title of host publication	Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018
Editors	Eyad Masad, Ilaria Menapace, Amit Bhasin, Tom Scarpas, Anupam Kumar
Publisher	CRC Press/Balkema
Pages	579-582
Number of pages	4
ISBN (Print)	9781138313095
State	Published - 2018
Externally published	Yes
Event	International Conference on Advances in Materials and Pavement Performance Prediction, AM3P 2018 - Doha, Qatar Duration: Apr 16 2018 → Apr 18 2018

Publication series

Name	Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018

Conference

Conference	International Conference on Advances in Materials and Pavement Performance Prediction, AM3P 2018
Country/Territory	Qatar
City	Doha
Period	4/16/18 → 4/18/18

ASJC Scopus subject areas

Civil and Structural Engineering
Mechanics of Materials
Materials Science(all)

Library availability

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Motamed, A., Komaragiri, S., Filonzi, A., Hajj, R., & Bhasin, A. (2018). Three-dimensional profiler for performance evaluation of chip seals. In E. Masad, I. Menapace, A. Bhasin, T. Scarpas, & A. Kumar (Eds.), Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018 (pp. 579-582). (Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018). CRC Press/Balkema.

Three-dimensional profiler for performance evaluation of chip seals. / Motamed, Arash; Komaragiri, Satyavati; Filonzi, Angelo et al.
Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018. ed. / Eyad Masad; Ilaria Menapace; Amit Bhasin; Tom Scarpas; Anupam Kumar. CRC Press/Balkema, 2018. p. 579-582 (Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Motamed, A, Komaragiri, S, Filonzi, A, Hajj, R & Bhasin, A 2018, Three-dimensional profiler for performance evaluation of chip seals. in E Masad, I Menapace, A Bhasin, T Scarpas & A Kumar (eds), Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018. Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018, CRC Press/Balkema, pp. 579-582, International Conference on Advances in Materials and Pavement Performance Prediction, AM3P 2018, Doha, Qatar, 4/16/18.

Motamed A, Komaragiri S, Filonzi A, Hajj R, Bhasin A. Three-dimensional profiler for performance evaluation of chip seals. In Masad E, Menapace I, Bhasin A, Scarpas T, Kumar A, editors, Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018. CRC Press/Balkema. 2018. p. 579-582. (Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018).

Motamed, Arash ; Komaragiri, Satyavati ; Filonzi, Angelo et al. / Three-dimensional profiler for performance evaluation of chip seals. Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018. editor / Eyad Masad ; Ilaria Menapace ; Amit Bhasin ; Tom Scarpas ; Anupam Kumar. CRC Press/Balkema, 2018. pp. 579-582 (Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018).

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ER -

Three-dimensional profiler for performance evaluation of chip seals

Abstract

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Conference

ASJC Scopus subject areas

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