TY - GEN
T1 - Three-dimensional profiler for performance evaluation of chip seals
AU - Motamed, Arash
AU - Komaragiri, Satyavati
AU - Filonzi, Angelo
AU - Hajj, Ramez
AU - Bhasin, Amit
N1 - Publisher Copyright:
© 2018 Taylor & Francis Group, London.
PY - 2018
Y1 - 2018
N2 - Chip seals are a very important and commonly used tool to preserve and extend the life of flexible pavements and restore skid resistance, particularly for pavements with low to medium traffic volume. Despite its wide spread use, there is lack of quantitative, rapid and objective methods to quantify the quality of chip seals in the laboratory as well as in the field. This paper demonstrates the feasibility of using a three-dimensional laser profiler to measure metrics that can be used to assess the quality and performance of chip seals, particularly embedment depth.
AB - Chip seals are a very important and commonly used tool to preserve and extend the life of flexible pavements and restore skid resistance, particularly for pavements with low to medium traffic volume. Despite its wide spread use, there is lack of quantitative, rapid and objective methods to quantify the quality of chip seals in the laboratory as well as in the field. This paper demonstrates the feasibility of using a three-dimensional laser profiler to measure metrics that can be used to assess the quality and performance of chip seals, particularly embedment depth.
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M3 - Conference contribution
AN - SCOPUS:85061243993
SN - 9781138313095
T3 - Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018
SP - 579
EP - 582
BT - Advances in Materials and Pavement Performance Prediction - Proceedings of the International AM3P Conference, 2018
A2 - Masad, Eyad
A2 - Menapace, Ilaria
A2 - Bhasin, Amit
A2 - Scarpas, Tom
A2 - Kumar, Anupam
PB - CRC Press/Balkema
T2 - International Conference on Advances in Materials and Pavement Performance Prediction, AM3P 2018
Y2 - 16 April 2018 through 18 April 2018
ER -