Abstract

Cell-encapsulated hydrogels with complex three-dimensional (3D) structures were fabricated from photopolymerizable poly(ethylene glycol) diacrylate (PEGDA) using modified 'top-down' and 'bottoms-up' versions of a commercially available stereolithography apparatus (SLA). Swelling and mechanical properties were measured for PEGDA hydrogels with molecular weights (Mw) ranging from 700 to 10000 Daltons (Da). Long-term viability of encapsulated NIH/3T3 cells was quantitatively evaluated using an MTS assay and shown to improve over 14 days by increasing the Mw of the hydrogels. Addition of adhesive RGDS peptide sequences resulted in increased cell viability, proliferation, and spreading compared to pristine PEG hydrogels of the same Mw. Spatial 3D layer-by-layer cell patterning was successfully demonstrated, and the feasibility of depositing multiple cell types and material compositions into distinct layers was established.

Original languageEnglish (US)
Pages (from-to)2062-2070
Number of pages9
JournalLab on a chip
Volume10
Issue number16
DOIs
StatePublished - Aug 21 2010

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Stereolithography
Hydrogels
Encapsulation
Polyethylene glycols
Molecular Weight
Molecular weight
arginyl-glycyl-aspartyl-serine
NIH 3T3 Cells
Cell proliferation
Adhesives
Peptides
Swelling
Assays
Cell Survival
Cell Proliferation
Mechanical properties
Chemical analysis
poly(ethylene glycol)diacrylate

ASJC Scopus subject areas

  • Bioengineering
  • Biochemistry
  • Chemistry(all)
  • Biomedical Engineering

Cite this

Three-dimensional photopatterning of hydrogels using stereolithography for long-term cell encapsulation. / Chan, Vincent; Zorlutuna, Pinar; Jeong, Jae Hyun; Kong, Hyunjoon; Bashir, Rashid.

In: Lab on a chip, Vol. 10, No. 16, 21.08.2010, p. 2062-2070.

Research output: Contribution to journalArticle

Chan, Vincent ; Zorlutuna, Pinar ; Jeong, Jae Hyun ; Kong, Hyunjoon ; Bashir, Rashid. / Three-dimensional photopatterning of hydrogels using stereolithography for long-term cell encapsulation. In: Lab on a chip. 2010 ; Vol. 10, No. 16. pp. 2062-2070.
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