Thin-film materials and minimum thermal conductivity

S. M. Lee, George Matamis, David G. Cahill, W. P. Allen

Research output: Contribution to journalArticlepeer-review

Abstract

The theoretical minimum thermal conductivity can be used to model heat transport in a wide variety of bulk and thin-film materials with strong atomic-scale disorder. To explore the possibility of using metastable microstructures in thin-film materials to achieve significant reductions in conductivity, we present experimental results - obtained using the 3ω method in the temperature range 77-400 K - on two novel systems. (1) The thermal conductivity of a low-dielectric-constant "flowable oxide" (HSiO1.5, hydrogen silsesquioxane) is greatly reduced relative to SiO2. (2) The thermal conductivity of stabilized zirconia /SiO2 multilayers is unchanged by solid-solid interfaces separated by nanometer length scales.

Original languageEnglish (US)
Pages (from-to)31-36
Number of pages6
JournalMicroscale Thermophysical Engineering
Volume2
Issue number1
DOIs
StatePublished - Feb 1 1998

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science (miscellaneous)
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Physics and Astronomy (miscellaneous)

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