Abstract
Thermomechanical fatigue (TMF) and isothermal fatigue of unreinforced and SiCp-reinforced aluminum 2xxx-T4 alloy were examined. Thermomechanical fatigue experiments were conducted under T min = 100 °C, T max = 300 °C and T min = 100 °C, T max = 200 °C conditions, and isothermal experiments were conducted at 200 °C and 300 °C. Based on stress range, substantial improvements in fatigue life were observed with reinforcement under both isothermal and thermomechanical loading conditions. Based on strain range, the TMF lives of the reinforced material increased in out-of-phase (OP) loading and remained unchanged in in-phase (IP) loading. A decrease in isothermal fatigue lives of the reinforced material compared to those of unreinforced material was observed in both 3 × 10-3 s-1 and 3 × 10-5 s-1 experiments at 200 °C and in 3 × 10-3 s-1 experiments at 300 °C. Crack growth mechanism maps were constructed to identify crack growth behavior of the unreinforced and the reinforced materials. The TMF OP conditions were more favorable to transgranular cracking. Mixed (transgranular and intergranular) crack growth occurred in TMF IP experiments. Evidence of void formation at grain boundaries, crack deflection due to particles, and oxide penetration at the crack tips is demonstrated using scanning electron microscopy (SEM) and Auger spectroscopy analysis.
Original language | English (US) |
---|---|
Pages (from-to) | 697-707 |
Number of pages | 11 |
Journal | Metallurgical Transactions A |
Volume | 22 |
Issue number | 3 |
DOIs | |
State | Published - Mar 1991 |
ASJC Scopus subject areas
- Condensed Matter Physics
- Mechanics of Materials
- Metals and Alloys