Thermoelastic properties of plain weave composites for multilayer circuit board applications

N. R. Sottos, J. M. Ockers, M. Swindeman

Research output: Contribution to journalArticlepeer-review

Abstract

The thermoelastic properties of woven glass/epoxy substrates for multilayer circuit board applications were investigated and the influence of fabric geometry assessed. The woven fabric geometry of several commercially pressed boards was carefully characterized using optical microscopy. The elastic moduli and Poisson's ratios were then measured in uniaxial tension, while the CTEs of the boards were measured using thermal mechanical analysis (TMA) at temperatures above and below the glass transition. Experimental data were compared to predictions from two new analytical models. One of the models, which does not use classical lamination theory, results in a significant improvement for the prediction of Poisson's ratio and CTEs. Finally, a parametric study was performed to demonstrate the effect of fiber crimp on the properties of the fabric.

Original languageEnglish (US)
Pages (from-to)37-43
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume121
Issue number1
DOIs
StatePublished - Mar 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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