Thermodynamic modeling and calorimetry of nanostructured materials for capacitive thermal management

Oksen T. Baris, Hongxiang Tian, Sanjiv Sinha

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Transient power dissipation profiles in handheld electronic devices alternate between high and low power states depending on usage. Capacitive thermal management based on phase change materials potentially offers a fan-less thermal management for such transient profiles. However, such capacitive management becomes feasible only if there is a significant enhancement in the enthalpy change per unit volume of the phase change material since existing bulk materials such as paraffin fall short of requirements. In this paper we propose novel nanostructured thin-film materials that can potentially exhibit significantly enhanced volumetric enthalpy change. Using fundamental thermodynamics of phase transition, we calculate the enhancement resulting from superheating in such thin film systems. We further describe the design of a microfabricated calorimeter to measure such enhancements. This work advances the state-of-art of phase change materials for capacitive cooling of handheld devices.

Original languageEnglish (US)
Title of host publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOIs
StatePublished - 2010
Event2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV, United States
Duration: Jun 2 2010Jun 5 2010

Publication series

Name2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Other

Other2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Country/TerritoryUnited States
CityLas Vegas, NV
Period6/2/106/5/10

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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