TY - GEN
T1 - Thermo-mechanical characterization of materials at micro/nanoscal E under bending
AU - Elhebeary, Mohamed
AU - Saif, M. Taher A.
N1 - Funding Information:
This proje ct was fund ed by the N ational Science Foundation (NSF) award No.1562694. The single crystal silicon samples were fabricated in Micro-Nano-Mechanical-Systems Laboratory at University of Illinois Urbana Champaign (UIUC). The bending test was performed in the Mic roscop y S uite at B eckman Instit ute for Advanced Science and Technology at UIUC.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - This paper presents a new method for testing materials at the microscale at high temperature under bending in-situ in SEM. The proposed method consists of a straining stage with built-in force and displacement sensors attached to a heating stage inside the SEM. The sample is co-fabricated with the stage to eliminate any misalignment error. The method is applied to test the strength of single crystal silicon (SCS) micro-beams under bending. At room temperature, bending tests revealed strengthening of SCS compared to that under uniform tension. This strengthening is contributed by stress localization near the surface of the beams close to the anchors, and the stress gradient from the surface to the neutral axis. The study further reveals significant reduction in the Brittle to Ductile Transition (BDT) temperature of SCS micro-beams compared to their bulk counterparts.
AB - This paper presents a new method for testing materials at the microscale at high temperature under bending in-situ in SEM. The proposed method consists of a straining stage with built-in force and displacement sensors attached to a heating stage inside the SEM. The sample is co-fabricated with the stage to eliminate any misalignment error. The method is applied to test the strength of single crystal silicon (SCS) micro-beams under bending. At room temperature, bending tests revealed strengthening of SCS compared to that under uniform tension. This strengthening is contributed by stress localization near the surface of the beams close to the anchors, and the stress gradient from the surface to the neutral axis. The study further reveals significant reduction in the Brittle to Ductile Transition (BDT) temperature of SCS micro-beams compared to their bulk counterparts.
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U2 - 10.1109/MEMSYS.2017.7863513
DO - 10.1109/MEMSYS.2017.7863513
M3 - Conference contribution
AN - SCOPUS:85015723520
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 736
EP - 739
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -