Thermo-mechanical characterization of materials at micro/nanoscal E under bending

Mohamed Elhebeary, M. Taher A. Saif

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a new method for testing materials at the microscale at high temperature under bending in-situ in SEM. The proposed method consists of a straining stage with built-in force and displacement sensors attached to a heating stage inside the SEM. The sample is co-fabricated with the stage to eliminate any misalignment error. The method is applied to test the strength of single crystal silicon (SCS) micro-beams under bending. At room temperature, bending tests revealed strengthening of SCS compared to that under uniform tension. This strengthening is contributed by stress localization near the surface of the beams close to the anchors, and the stress gradient from the surface to the neutral axis. The study further reveals significant reduction in the Brittle to Ductile Transition (BDT) temperature of SCS micro-beams compared to their bulk counterparts.

Original languageEnglish (US)
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages736-739
Number of pages4
ISBN (Electronic)9781509050789
DOIs
StatePublished - Feb 23 2017
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: Jan 22 2017Jan 26 2017

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period1/22/171/26/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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