Thermally managed LED arrays assembled by printing

Yonggang Huang; Hoon-Sik Kim; John A Rogers

Thermally managed LED arrays assembled by printing

Yonggang Huang (Inventor), Hoon-Sik Kim (Inventor), John A Rogers (Inventor)

Research output: Patent

Abstract

Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).

Original language	English (US)
U.S. patent number	9765934
Filing date	5/15/12
State	Published - Sep 19 2017

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title = "Thermally managed LED arrays assembled by printing",

abstract = "Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).",

author = "Yonggang Huang and Hoon-Sik Kim and Rogers, {John A}",

note = "STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with United States governmental support under Award No. DEFG02-91 ER45439 awarded by the U.S. Department of Energy. The U.S. government has certain rights in the invention.; 9765934",

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day = "19",

language = "English (US)",

type = "Patent",

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AU - Huang, Yonggang

AU - Kim, Hoon-Sik

AU - Rogers, John A

N1 - STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with United States governmental support under Award No. DEFG02-91 ER45439 awarded by the U.S. Department of Energy. The U.S. government has certain rights in the invention.

PY - 2017/9/19

Y1 - 2017/9/19

N2 - Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).

AB - Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).

M3 - Patent

M1 - 9765934

Y2 - 2012/05/15

ER -

Thermally managed LED arrays assembled by printing

Abstract

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