Thermal resistance of VCSEL's bonded to integrated circuits

Rui Pu, Carl W. Wilmsen, Kent M. Geib, Kent D. Choquette

Research output: Contribution to journalArticlepeer-review


The thermal resistance of vertical-cavity surface-emitting lasers (VCSEL's) flip chip bonded to GaAs substrates and CMOS integrated circuits has been measured. The measurements on GaAs show that if the bonding is done properly, the bonding does not add significantly to the thermal resistance. However, the SiO2 under the CMOS bonding pad can double the thermal resistance unless measures are taken to improve the thermal conductance of these layers. Finite element simulations indicate that the thermal resistance of bonded VCSEL's increases rapidly as the solder bond size and the aperture size decrease below approximately 10 μm.

Original languageEnglish (US)
Pages (from-to)1554-1556
Number of pages3
JournalIEEE Photonics Technology Letters
Issue number12
StatePublished - Dec 1999
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering


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