Keyphrases
Electrical Properties
100%
Thermoelectric Properties
100%
Inverse Opal Structure
100%
Thermal Reliability
100%
Reliability Properties
100%
Copper Inverse Opals
100%
Finite Element Analysis
40%
Thermal Properties
40%
Close-packed
20%
Mechanical Properties
20%
Thermal Cycling
20%
Electrical Conductivity
20%
Heat Transfer
20%
Pore Structure
20%
Colloidal Crystal
20%
Porous Materials
20%
Scanning Electron Micrograph
20%
Cooling Applications
20%
Interconnected Porosity
20%
Shear Measurement
20%
Electroplating
20%
Stress Concentration
20%
Pure Copper
20%
Metallic Copper
20%
Thin Regions
20%
Four-point Probe
20%
Energy Storage Applications
20%
Value-based
20%
Eddy Current
20%
Failure Plane
20%
Lap Shear Strength
20%
Electroplated Copper
20%
Two-phase Cooling
20%
Heat Energy
20%
Engineering
Finite Element Method
100%
Interconnects
100%
Micrograph
50%
Porosity
50%
Electrical Conductivity
50%
Stress Concentration
50%
Pure Copper
50%
Probe Point
50%
Energy Storage Application
50%
Failure Plane
50%
Material Science
Finite Element Method
100%
Electrical Conductivity
50%
Thermal Property
50%
Stress Concentration
50%
Thermal Cycling
50%
Pore Structure
50%