Thermal performance of low-melting-temperature alloy thermal interface materials

E. Yang, Hongyan Guo, Jingdong Guo, Jianku Shang, Mingguang Wang

Research output: Contribution to journalArticle

Abstract

Thermal resistance of low-melting-temperature alloy (LMTA) thermal interface materials (TIMs) was measured by laser flash method before and after different stages of heating. The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process. It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs. Due to the fast growth rate of intermetallic compound (IMC) at the solid-liquid interface, a thick brittle IMC is layer formed at the interface, which makes cracks easy to initiate and expand. Otherwise, the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase, and so, the TIM layer will not melt at the operating temperature.

Original languageEnglish (US)
Pages (from-to)290-294
Number of pages5
JournalActa Metallurgica Sinica (English Letters)
Volume27
Issue number2
DOIs
StatePublished - Apr 2014

Keywords

  • Low melting point alloy
  • Thermal interface materials
  • Thermal resistance

ASJC Scopus subject areas

  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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