Thermal modeling of transferred VCSELs

Hyejin Jeong, Kent D Choquette

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Vertical cavity surface emitting lasers (VCSELs) are an important light source for applications in communication and appliances consumer use. However, the types of III-V semiconductor materials that can be used to manufacture monolithic VCSELs are limited to only few choices. Moreover, limitations of the device materials will also limit the functionality of VCSELs incorporated into microsystems. Various heterogeneous integration approaches have been developed to overcome this limits [1, 2]. We previously demonstrated a bonding approach onto foreign substrates which incorporates fully fabricated VCSEL arrays which do not require additional processing after bonding and optical characteristics are maintained after the bonding process [3]. In this work we report VCSEL thermal modeling using COMSOL simulations to investigate the relation between laser performance and temperature. Good agreement is obtained between simulation and experiments for VCSEL lasing wavelength with varying oxide aperture and mesa size under operation near maximum output power. Using this model, the thermal rollover at peak output power of VCSELs on different substrates is discussed.

Original languageEnglish (US)
Title of host publication2013 IEEE Photonics Conference, IPC 2013
Number of pages2
StatePublished - 2013
Event2013 26th IEEE Photonics Conference, IPC 2013 - Bellevue, WA, United States
Duration: Sep 8 2013Sep 12 2013

Publication series

Name2013 IEEE Photonics Conference, IPC 2013


Other2013 26th IEEE Photonics Conference, IPC 2013
Country/TerritoryUnited States
CityBellevue, WA

ASJC Scopus subject areas

  • Instrumentation


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