Thermal-driven analog placement considering device matching

Mark Po Hung Lin, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

Research output: Contribution to journalArticle

Abstract

With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. This paper first introduces the properties of a desired thermal profile for better thermal matching of the matched devices. It then presents a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that the proposed approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

Original languageEnglish (US)
Article number5715604
Pages (from-to)325-336
Number of pages12
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume30
Issue number3
DOIs
StatePublished - Mar 1 2011

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Keywords

  • Analog circuit
  • floorplanning
  • physical design
  • placement
  • thermal effect

ASJC Scopus subject areas

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

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