Thermal-driven analog placement considering device matching

Po Hung Lin, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

Original languageEnglish (US)
Title of host publication2009 46th ACM/IEEE Design Automation Conference, DAC 2009
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages593-598
Number of pages6
ISBN (Print)9781605584973
DOIs
StatePublished - 2009
Event2009 46th ACM/IEEE Design Automation Conference, DAC 2009 - San Francisco, CA, United States
Duration: Jul 26 2009Jul 31 2009

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Other

Other2009 46th ACM/IEEE Design Automation Conference, DAC 2009
CountryUnited States
CitySan Francisco, CA
Period7/26/097/31/09

Keywords

  • Analog placement
  • Thermal matching

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Modeling and Simulation
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Thermal-driven analog placement considering device matching'. Together they form a unique fingerprint.

  • Cite this

    Lin, P. H., Zhang, H., Wong, M. D. F., & Chang, Y. W. (2009). Thermal-driven analog placement considering device matching. In 2009 46th ACM/IEEE Design Automation Conference, DAC 2009 (pp. 593-598). [5227072] (Proceedings - Design Automation Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/1629911.1630064