Thermal contact conductance of adhered microcantilevers

Scott T. Huxtable, David G Cahill, Leslie M. Phinney

Research output: Contribution to journalArticlepeer-review


An approach for measuring the cantilever-substrate interfacial thermal conductance using a combination of picosecond acoustics, time-domain thermoreflectance (TDTR), and a modified method. As such, picosecond acoustics are used to accurately measure film thicknesses as well as to shed some light on the nature of the adhesion between the cantilever and the substrate. The modified technique provides a secondary measurement of the interfacial thermal conductance and is used to measure the lateral, or in-plane, thermal conductivity of the cantilever.

Original languageEnglish (US)
Pages (from-to)2102-2108
Number of pages7
JournalJournal of Applied Physics
Issue number4
StatePublished - Feb 15 2004

ASJC Scopus subject areas

  • Physics and Astronomy(all)


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