Thermal contact conductance of adhered microcantilevers

An approach for measuring the cantilever-substrate interfacial thermal conductance using a combination of picosecond acoustics, time-domain thermoreflectance (TDTR), and a modified method. As such, picosecond acoustics are used to accurately measure film thicknesses as well as to shed some light on the nature of the adhesion between the cantilever and the substrate. The modified technique provides a secondary measurement of the interfacial thermal conductance and is used to measure the lateral, or in-plane, thermal conductivity of the cantilever.