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Thermal conductance of interfaces between highly dissimilar materials
Ho Ki Lyeo,
David G. Cahill
Materials Science and Engineering
Mechanical Science and Engineering
Materials Research Lab
Physics
Grainger College of Engineering
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Keyphrases
Thermal Conductance
100%
Dissimilar Materials
100%
Hydrogen-terminated Diamond
66%
Debye Temperature
66%
Semiconductors
33%
Time-domain Thermoreflectance
33%
K(I)
33%
Conductance
33%
Room Temperature
33%
Thermal Transport
33%
Phonons
33%
Lattice Vibration
33%
Dielectric
33%
Native Oxide
33%
Sapphire
33%
Decreasing Temperature
33%
Hydrogen-terminated
33%
Interface Thermal Conductance
33%
Thermal Energy
33%
Semimetal
33%
Dielectric Substrate
33%
Material Combination
33%
Radiation Limits
33%
Engineering
Diamond
100%
Dielectrics
100%
Time Domain
50%
Room Temperature
50%
Decreasing Temperature
50%
Thermal Energy
50%
Material Science
Dielectric Material
100%
Diamond
100%
Oxide Compound
50%
Lattice Vibration
50%
Sapphire
50%
Semimetals
50%