TY - GEN
T1 - Thermal-aware IR drop analysis in large power grid
AU - Zhong, Yu
AU - Wong, Martin D.F.
PY - 2008
Y1 - 2008
N2 - Due to the positive feedback loop between power grid Joule heating and the linear temperature dependence of resistivity, non-uniform temperature profiles on the power grid in high-performance IC influence the IR drop in the power grid. Lack of accurate evaluation of thermal effect on the IR drop in the power grid may lead to over-design; or worse, underestimates the IR drop due to increased local temperature. This paper presents a method to compute the temperature-dependent IR drop on the power grid extremely fast. We propose a novel thermal model and a mathematical formulation to compute the temperature profiles on the power grid efficiently. Compared to the traditional thermal lumped model, which gives a much larger thermal network than the original power grid (20 times more nodes), our model takes advantage of power grid properties, and reduces the size of the thermal equivalent network dramatically (only 13% of the size of the power grid). Iterative methods [16] are used to efficiently update the IR drops based on the new temperature profile. Experimental results show that without considering temperature impact, the worst IR drop analysis can have error up to 10%.
AB - Due to the positive feedback loop between power grid Joule heating and the linear temperature dependence of resistivity, non-uniform temperature profiles on the power grid in high-performance IC influence the IR drop in the power grid. Lack of accurate evaluation of thermal effect on the IR drop in the power grid may lead to over-design; or worse, underestimates the IR drop due to increased local temperature. This paper presents a method to compute the temperature-dependent IR drop on the power grid extremely fast. We propose a novel thermal model and a mathematical formulation to compute the temperature profiles on the power grid efficiently. Compared to the traditional thermal lumped model, which gives a much larger thermal network than the original power grid (20 times more nodes), our model takes advantage of power grid properties, and reduces the size of the thermal equivalent network dramatically (only 13% of the size of the power grid). Iterative methods [16] are used to efficiently update the IR drops based on the new temperature profile. Experimental results show that without considering temperature impact, the worst IR drop analysis can have error up to 10%.
UR - http://www.scopus.com/inward/record.url?scp=49749096087&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49749096087&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2008.4479725
DO - 10.1109/ISQED.2008.4479725
M3 - Conference contribution
AN - SCOPUS:49749096087
SN - 0769531172
SN - 9780769531175
T3 - Proceedings of the 9th International Symposium on Quality Electronic Design, ISQED 2008
SP - 194
EP - 199
BT - Proceedings of the 9th International Symposium on Quality Electronic Design, ISQED 2008
T2 - 9th International Symposium on Quality Electronic Design, ISQED 2008
Y2 - 17 March 2008 through 19 March 2008
ER -