Thermal-aware DC IR-drop co-analysis using non-conformal domain decomposition methods

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Contribution to journalArticlepeer-review

Abstract

Almost all practical engineering applications are multi-physics in nature, and various physical phenomena usually interact and couple with each other. For instance, the resistivity of most conducting metals increases linearly with increases in the surrounding temperature resulting from Joule heating by electrical currents flowing through conductors. Therefore, in order to accurately characterize the performance of high-power integrated circuits (ICs), packages and printed circuit boards (PCBs), it is essential to account for both electrical and thermal effects and the intimate couplings between them. In this paper, we present non-conformal, non-overlapping domain decomposition methods (DDMs) for thermal-aware direct current (DC) IR drop co-analysis of high-power chippackage- PCBs. Here, IR stands for the finite resistivity (R) of metals and current (I) drawn off from the power/ground planes. The proposed DDM starts by partitioning the composite device into inhomogeneous sub-regions with temperature-dependent material properties. Subsequently, each sub-domain is meshed independently according to its own characteristic features. As a consequence, the troublesome mesh-generation task for complex ICs can be greatly subdued. The proposed thermal-aware DC IR drop co-analysis applies the non-conformal DDM for both conduction and steady-state heattransfer analyses with a two-way coupling between them. Numerical examples, including an IC package and a chip-package-PCB, demonstrate the flexibility and potential of the proposed thermal-aware DC IR-drop co-analysis using non-conformal DDMs.

Original languageEnglish (US)
Pages (from-to)1652-1675
Number of pages24
JournalProceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences
Volume468
Issue number2142
DOIs
StatePublished - Jun 8 2012
Externally publishedYes

Keywords

  • Computational thermal analysis
  • Domain decomposition method
  • Non-conformal interfaces
  • Thermal-aware IR-drop analysis

ASJC Scopus subject areas

  • Mathematics(all)
  • Engineering(all)
  • Physics and Astronomy(all)

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