Thermal atomic layer etching of copper by sequential steps involving oxidation and exposure to hexafluoroacetylacetone

Keyphrases

• Copper(II) Oxide 100%
• Copper Surface 100%
• Hydrogen Peroxide 100%
• HFACS 100%
• Hexafluoroacetylacetonate 100%
• Thermal Atomic Layer Etching 100%
• Silica 50%
• Thick Layer 50%
• Cu Surface 50%
• Molecular Oxygen 50%
• Dielectric 50%
• Etching Process 50%
• Surface Reaction 50%
• Oxidized Surface 50%
• Self-limiting 50%
• SiNx 50%
• Etching Depth 50%
• Strong Oxidants 50%
• Atomic Layer Etching 50%
• Cyclic Exposure 50%

Material Science

• Oxidation Reaction 100%
• Oxidant 100%
• Dielectric Material 25%
• Surface Reaction 25%

Chemical Engineering

• Disproportionation Reaction 100%
• Molecular Oxygen 100%