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Thermal and radiation-enhanced diffusion in Cu
3
Au
Y. S. Lee
, C. P. Flynn
,
R. S. Averback
Materials Science and Engineering
Materials Research Laboratory
Research output
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›
peer-review
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3
Au'. Together they form a unique fingerprint.
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Material Science
Thin Films
100%
Molecular Beam Epitaxy
50%
Diffusivity
50%
Alloy
50%
Thermal Diffusion
50%
Crystal Structure
50%
Chemical Engineering
Film
100%
Molecular Beam Epitaxy
50%
Thermal Diffusion
50%
Diffusion
50%
Keyphrases
Temperature Regime
33%